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Multilayer HDI PCB with Micro BGA Assembled

Multilayer HDI PCB with Micro BGA Assembled

Multilayer HDI PCB with Micro BGA Assembled
Multilayer HDI PCB with Micro BGA AssembledMultilayer HDI PCB with Micro BGA AssembledMultilayer HDI PCB with Micro BGA Assembled
CategoriesIndustries Served
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Brand86PCB
Board Material :KB FR4 TG170
Thickness:1.0mm
Size:50*25mm
Update Time2018-12-13
Detail Information

Specification

Board Material:  KB FR4 TG170

Board Thickness:  1.0mm

Size:  50*25mm

Layer:  6 Layer

Copper Thickness:  1OZ

Surface Finishing:  ENIG

Solder Mask:  Green

Silkprint:  White


Core part


This PCBA is for a high-tech innovation product smart boots. PCB is 6 layer HDI PCB with blind holes,very small size and irregular shape. There are total 9 BGA on this board, all of them are mini BGA. The minimum distance between ball centre  is 0.4mm,minimum distance between ball edge is 0.15mm. There are two BGA with 4 balls,which needs rich experience and sophisticated SMT equipment to do this assembly work. 

Test & Inspection

To ensure the assembly quality , X-RAY test is necessary. And the result is very good, all of those BGA are asembled perfectly . 

Xray test

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